IPFA 2025

Summary Report

IPFA 2025 has completed and see you at IPFA 2026 in Singapore.
 
for IPFA2025 Photos, please visit:  https://bit.ly/IPFA2025_FOTO
 
 
We are returning to Penang, our venue is at the Setia SPICE Convention Centre, Penang, Malaysia.
Disclaimer: All IPFA2025 registration is through Softconf website and/or IPFA secretariat (eg: HRDF). We do not engage with any 3rd party event organizer to handle registration that involved money transaction.
Registration is Open NOW!         Visit: https://ipfaieee.org/2025/registration/
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32nd IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS

Date

5th-8th Aug 2025

Venue

Spice Convention Centre, Penang, Malaysia

IPFA 2025 Best Paper

Best Poster Paper (FA Track):

POS1.31 / ID 70 / FA5 –

New Insight into Backside Metallization Discoloration through Advanced Physical Failure Analysis

Presenting Author: Reeson Kek

Best Poster Paper (REL Track):

POS2.26 / ID 86 / ST5 –

Strain-invariant conductors from liquid metal and silver microsheets

Presenting Author: Junhao Shen

Best Oral Paper (FA Track):

4A.1 / ID 35

Novel Thick Low K via PFIB Delayering Methodology Development

Presenting Author: Benjamin Lo Yuen Sum

Best Oral Paper (REL Track):

1B.4 / ID 114

Investigation of RF Stress on the Characteristics of GaN-on-Si HEMTs

Presenting Author: Yujun Wei

Art of FA Contest

Discover the art within failure. The IPFA’s “ART of FA” contest invites you to transform your analytical insights into compelling visual narratives. Capture the unseen beauty and tell the stories behind the science through stunning photos and videos. With your FA tools as your creative partners, share your unique perspective for a chance to win exciting prizes. Submit your entries via the form below before July 15, 2025.

Call For Late Breaking News Paper (Done)

Did you miss the abstract submission deadline? Don’t worry!

You can now submit your late breaking research to IPFA 2025!
Please submit your full manuscript (minimum 4 pages, including text and figures) of your original work.

Your full manuscript must adhere to IEEE format to be considered for acceptance.

You may send your full manuscript directly to our Technical Program Chairs:

Dr. Pok Fen Wei (FenWei.Pok@wdc.com),
Ms. Bernice Zee (bernice.zee@amd.com),
Dr.Ooi Poh Choon (pcooi@ukm.edu.my).

Call For Papers (Done)

The IPFA 2025 Call for Papers focuses on cutting-edge research in failure analysis (FA), reliability (REL), and specialized technology (ST) within integrated circuits. It invites submissions on topics such as advanced fault isolation techniques, physical and package-level failure analysis, transistor reliability, ESD, latch-up, and
the integration of AI for failure detection and reliability assessments.

Call For Sponsors (All Booths Sold)

The success of IPFA 2023 (Penang) & IPFA 2024 (Singapore) through strong collaboration between local industry stakeholders, academics and professionals in semiconductor field has amplified the motivation and the spirit of IPFA Organizing Committee to make IPFA 2025 a memorable event.

This event can only be a success with your organization’s generous sponsorship and/or exhibit. We are confident that your organization will gain visibility through comprehensive outreach to numerous industry stakeholders. The Sponsor’s Prospectus can be obtained by clicking the link below, which will provide you with all the details on sponsorships and exhibition options for the IPFA2025 symposium.

HRD Corp SBL-Khas: 10001501441

Past Event Videos