IPFA 2025

We are returning to Penang, and this time our venue is at the Setia SPICE Convention Centre, Penang, Malaysia.

32^nd IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS

Date

5th-8th Aug 2025

Venue

Spice Convention Centre, Penang, Malaysia

Call For Papers

The IPFA 2025 Call for Papers focuses on cutting-edge research in failure analysis (FA), reliability (REL), and specialized technology (ST) within integrated circuits. It invites submissions on topics such as advanced fault isolation techniques, physical and package-level failure analysis, transistor reliability, ESD, latch-up, and
the integration of AI for failure detection and reliability assessments.

Call For Sponsors

The success of IPFA 2023 (Penang) & IPFA 2024 (Singapore) through strong collaboration between local industry stakeholders, academics and professionals in semiconductor field has amplified the motivation and the spirit of IPFA Organizing Committee to make IPFA 2025 a memorable event.

This event can only be a success with your organization’s generous sponsorship and/or exhibit. We are confident that your organization will gain visibility through comprehensive outreach to numerous industry stakeholders. The Sponsor’s Prospectus can be obtained by clicking the link below, which will provide you with all the details on sponsorships and exhibition options for the IPFA2025 symposium.