5th-8th Aug 2025
Spice Convention Centre, Penang, Malaysia
Did you miss the abstract submission deadline? Don’t worry!
You can now submit your late breaking research to IPFA 2025!
Please submit your full manuscript (minimum 4 pages, including text and figures) of your original work.
Your full manuscript must adhere to IEEE format to be considered for acceptance.
You may send your full manuscript directly to our Technical Program Chairs:
Dr. Pok Fen Wei (FenWei.Pok@wdc.com),
Ms. Bernice Zee (bernice.zee@amd.com),
Dr.Ooi Poh Choon (pcooi@ukm.edu.my).
The IPFA 2025 Call for Papers focuses on cutting-edge research in failure analysis (FA), reliability (REL), and specialized technology (ST) within integrated circuits. It invites submissions on topics such as advanced fault isolation techniques, physical and package-level failure analysis, transistor reliability, ESD, latch-up, and
the integration of AI for failure detection and reliability assessments.
The success of IPFA 2023 (Penang) & IPFA 2024 (Singapore) through strong collaboration between local industry stakeholders, academics and professionals in semiconductor field has amplified the motivation and the spirit of IPFA Organizing Committee to make IPFA 2025 a memorable event.
This event can only be a success with your organization’s generous sponsorship and/or exhibit. We are confident that your organization will gain visibility through comprehensive outreach to numerous industry stakeholders. The Sponsor’s Prospectus can be obtained by clicking the link below, which will provide you with all the details on sponsorships and exhibition options for the IPFA2025 symposium.
Discover the art within failure. The IPFA’s “ART of FA” contest invites you to transform your analytical insights into compelling visual narratives. Capture the unseen beauty and tell the stories behind the science through stunning photos and videos. With your FA tools as your creative partners, share your unique perspective for a chance to win exciting prizes. Submit your entries via the form below before July 15, 2025.
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